On the morning of 19 December 2022, mayor of Nantong Wu Xinming met HIROKAZU OKADA, president of TOWA Co., Ltd. and his party by video conference. Both parties carried out in depth conversation about further improvement of cooperation.

Wu Xinming expressed gratitude to TOWA Co., Ltd. for choosing Nantong and investment in Nantong representing CPC Nantong Committee and Nantong government. Wu Xinming hoped that TOWA could grab the strategic opportunities of Nantong’s development, make full use of leading advantages of the industry, arrange more excellent projects, share opportunities and build the future together with Nantong. Nantong will focus strength, gather policies and resources to provide all round services for enterprises’ development.

HIROKAZU OKADA expressed gratitude to CPC Nantong Committee and Nantong government for care and support for the company’s development in Nantong. He said that since the start of construction of TOWA semiconductor equipment (Nantong) project in April 2020, it has progressed fast, and was completed and in operation within a year, which increased the confidence of TOWA to deep plough in Nantong.

TOWA semiconductor equipment (Nantong) project was invested and founded by world semiconductor packaging equipment and mold manufacture leading enterprise TOWA Co., Ltd. The total investment is 80 million U.S. dollars. The registered capital is 30 million U.S. dollars. TOWA semiconductor equipment (Nantong) project, as the largest investment project of TOWA group in Nantong, not only manufactures semiconductor packaging equipment and semiconductor ultra precision mold which represent the most advanced technology of TOWA, but also brought in the most advanced technology and equipment from Japan, which filled the gap of mold high quality plating which is difficult to be realized in China.